AMD Embedded G-Series Features & Specs
x86 core features:
  • Single or dual x86 "Bobcat" CPU cores
    • Up to 1.6GHz CPU clock rate
  • Advanced branch predictor
  • Out-of-order instruction execution
    • Full OOO instruction execution
    • Full OOO load/store engine
  • High Performance Floating Point
  • AMD64 64-bit ISA
  • SSE1,2,3, SSSE3 ISA, SSE4A
  • Secure Advanced Virtualization
GPU core features:
  • Dedicated graphics memory controller
    • High-efficiency ring bus memory controller
    • Direct connection to memory
  • 2D Acceleration
    • Highly-optimized 128-bit engine, capable of processing multiple pixels per clock
  • 3D Acceleration
    • Full DirectX 11 support, including full speed 32-bit floating point per component operations
    • Shader Model 5
    • OpenCL 1.1 support
    • OpenGL 3.2 and 2.1 support
  • Motion video acceleration
    • dedicated hardware (UVD 3) for H.264, VC-1, and MPEG2 decode
    • HD HQV and SD HQV support: noise removal, detail enchantment, color enhancement, cadence detection, sharpness, and advanced de-interlacing
    • Super up-conversion for SD to HD resolutions
Integrated DDR3 memory controller:
  • Support for solder-down, SODIMM and DIMM memory, two slots, non-ECC type
  • 64-bit DDR3 SDRAM controller operating at frequencies up to 1066 MT/s (533MHz)
On-chip cache:
  • 32KB I-Cache, 32KB D-Cache
  • 512KB L2 per Core
AMD virtualization technology (AMD-V):
  • SVM lock and unlock
  • Nested paging
  • Next RIP
  • LBR virtualization
  • 8 address space identifiers
  • Performance counter guest/host bit
  • Nested page table fault info
Integrated display interfaces:
  • Dual independent display support
  • Dual-link or dual single-link DVI
  • HDMI
  • Dual DisplayPort
  • LVDS
  • Analog VGA
Other I/O on APU and I/O Controller Hub (assumes A50M hub):
  • 4x1 or 1x4 PCIe on APU; additional 4x1 or 1x4 PCIe on Hub
  • 6x SATA 6Gbps
  • 14x USB 2.0
  • SPI, LPC, and SMBus interfaces
  • CIR
  • HD audio
  • Integrated clock generation
  • Fan control
  • Up to 102 GPIO
Additional I/O available with A55E hub option:
  • Gigabit Ethernet MAC
  • RAID (0/1/5/10) support with FIS-based switching
  • PCIe Generation 2 UMI connection to APU
  • 33MHz PCI Interface with support for 4 masters
Physical characteristics:
  • Package
    • APU -- 413-pin lidless micro BGA; 19 x 19 mm
    • Controller Hub -- 605-pin lidless FCBGA; 23 x 23 mm
  • Power
    • APU -- 9W or 18W TDP
    • GPU -- 4.7W TDP
  • Operating temperation range -- not currently disclosed